JPS60140785A - ハイブリッドicの実装構造 - Google Patents
ハイブリッドicの実装構造Info
- Publication number
- JPS60140785A JPS60140785A JP25158383A JP25158383A JPS60140785A JP S60140785 A JPS60140785 A JP S60140785A JP 25158383 A JP25158383 A JP 25158383A JP 25158383 A JP25158383 A JP 25158383A JP S60140785 A JPS60140785 A JP S60140785A
- Authority
- JP
- Japan
- Prior art keywords
- view
- hybrid
- present
- electronic components
- sectional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000000465 moulding Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25158383A JPS60140785A (ja) | 1983-12-27 | 1983-12-27 | ハイブリッドicの実装構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25158383A JPS60140785A (ja) | 1983-12-27 | 1983-12-27 | ハイブリッドicの実装構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60140785A true JPS60140785A (ja) | 1985-07-25 |
JPH0433158B2 JPH0433158B2 (en]) | 1992-06-02 |
Family
ID=17224970
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25158383A Granted JPS60140785A (ja) | 1983-12-27 | 1983-12-27 | ハイブリッドicの実装構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60140785A (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022072400A (ja) * | 2020-10-29 | 2022-05-17 | Tdk株式会社 | 電子部品 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6304377B2 (ja) * | 2014-06-23 | 2018-04-04 | 株式会社村田製作所 | 樹脂基板組合せ構造体 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58184782A (ja) * | 1982-04-22 | 1983-10-28 | 株式会社東芝 | プリント板パツケ−ジ構成法 |
JPS6041079U (ja) * | 1983-08-29 | 1985-03-23 | ソニー株式会社 | プリント回路基板 |
-
1983
- 1983-12-27 JP JP25158383A patent/JPS60140785A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58184782A (ja) * | 1982-04-22 | 1983-10-28 | 株式会社東芝 | プリント板パツケ−ジ構成法 |
JPS6041079U (ja) * | 1983-08-29 | 1985-03-23 | ソニー株式会社 | プリント回路基板 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022072400A (ja) * | 2020-10-29 | 2022-05-17 | Tdk株式会社 | 電子部品 |
Also Published As
Publication number | Publication date |
---|---|
JPH0433158B2 (en]) | 1992-06-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2821315B2 (ja) | シングルインラインモジュール | |
JPS60140785A (ja) | ハイブリッドicの実装構造 | |
JPS58188684U (ja) | 電子表示装置 | |
JPH04273200A (ja) | シールド装置 | |
JPS616832A (ja) | 実装体 | |
JPS63310151A (ja) | 集積回路電子部品のチップの支持パッド | |
JPS5996759A (ja) | 半導体装置 | |
JP2670505B2 (ja) | 電子部品搭載用基板 | |
JPS5846689A (ja) | 電子回路装置 | |
JP2879503B2 (ja) | 面実装型電子回路装置 | |
JPS60107896A (ja) | プリント基板装置 | |
JP2001168272A (ja) | フレキシブル基板及び半導体装置 | |
JPS60143618A (ja) | 電子部品 | |
JPS62277797A (ja) | 電気機器 | |
JPS5848496A (ja) | 小型電子回路部品構体 | |
JPS61278198A (ja) | 電子回路モジユ−ル | |
JP2606673B2 (ja) | 実装体 | |
JPS60140786A (ja) | チツプ型電子部品の実装構造 | |
JP2568812B2 (ja) | 実装体 | |
JPH0414852A (ja) | 半導体装置 | |
JPH05211380A (ja) | 電子部品の実装構造 | |
JPS5977243U (ja) | 半導体装置 | |
JPS60115287A (ja) | 混成集積回路装置 | |
JPS609147A (ja) | 混合集積回路 | |
JPS593989A (ja) | 配線装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |